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Welcome to Thin-film Process Engineering Lab.

Creation of new materials using next-generation thin-film formation technology

The Thin Film Process Engineering Laboratory conducts research on thin film and nanomaterial creation processes using plasma, aiming to further enhance the functionality of thin film materials and create new materials. By elucidating the dynamic properties of "ions" in plasma, we are striving to precisely control the constituent particles of materials at the atomic and molecular level, and to create novel materials that were difficult to form with conventional processes, and to commercialize them.

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Research Topics

Aiming to design processes based on plasma analysis and create novel thin-film materials and nanomaterials.

This laboratory was newly established in 2020, separating from the Advanced Materials Processing Laboratory (Yang Laboratory) of the Department of Mechanical Systems Engineering, Tokyo Metropolitan University. Building on our previous research on surface design and surface function creation in mechanical systems, we have contributed to numerous industrial fields, primarily through the development of innovative thin-film processes. For further details, please see below.

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Thin-film process development and application research using high-density pulsed plasma

We are developing high-performance thin-film processes that leverage the process control flexibility of high-power pulsed sputtering (HiPIMS) technology, which was developed in the early 2000s. By understanding the transient plasma characteristics in pulsed plasma, we can achieve control of ion particles in the plasma, which was previously difficult.

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